Conductive network for fabrics

ABSTRACT

An apparatus, method for making, and product by process for a parachute, the parachute having a conductive network and a set of fabrics; the conductive network including a set of conductive elements and a set of devices; wherein a first subset of conductive elements of the set of conductive elements is incorporated with a second subset of fabrics of the set of fabrics and third subset of devices of the set of devices incorporated is incorporated with a fourth subset of fabrics of the set of fabrics.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/330,347 titled “Conductive Networks for Parachute Fabrics” filedon May 2, 2016, which is hereby incorporated in its entirety herein byreference for all purposes.

BACKGROUND

Generally, it has not been possible to establish conductive networks inhigh static environments. For example, to date, parachute manufactureshave been unable to deploy sensor and communication platforms byintegrating conductive networks into a parachute fabric design andcanopy manufacture. This real-world demonstration of such an integrationor deployment has not successfully been achieved.

SUMMARY

An apparatus, method for making, and product by process for a parachute,the parachute having a conductive network and a set of fabrics; theconductive network including a set of conductive elements and a set ofdevices; wherein a first subset of conductive elements of the set ofconductive elements is incorporated with a second subset of fabrics ofthe set of fabrics and third subset of devices of the set of devicesincorporated is incorporated with a fourth subset of fabrics of the setof fabrics.

BRIEF DESCRIPTION OF THE DRAWINGS

Objects, features, and advantages of embodiments disclosed herein may bebetter understood by referring to the following description inconjunction with the accompanying drawings. The drawings are not meantto limit the scope of the claims included herewith. For clarity, notevery element may be labeled in every figure. The drawings are notnecessarily to scale, emphasis instead being placed upon illustratingembodiments, principles, and concepts. Thus, features and advantages ofthe present disclosure will become more apparent from the followingdetailed description of exemplary embodiments thereof taking inconjunction with the accompany drawings in which:

FIG. 1a is a simplified illustration of a parachute fabric with a seamand stitches and one or more conductors inserted into the seam, inaccordance with an embodiment of the current disclosure;

FIG. 1b is an alternative simplified illustration of a parachute fabricwith a seam and stitches and one or more conductors inserted into theseam, in accordance with an embodiment of the current disclosure;

FIG. 1c is a simplified illustration of a Faraday cage being layeredover a seam of a parachute, where one or more conductors are in theseam, in accordance with an embodiment of the current disclosure;

FIG. 1d is a simplified illustration of a Faraday cage layered over aseam of a parachute, where one or more conductors are in the seam, inaccordance with an embodiment of the current disclosure;

FIG. 1e is an alternative simplified illustration of a Faraday cagelayered over a seam of a parachute, where conductors forming aconductive network are in the seam, in accordance with an embodiment ofthe current disclosure;

FIG. 1f is a simplified illustration of a piece of parachute fabricbeing layered over a Faraday cage, which is layered over a seam of aparachute, where one or more conductors are in the seam and branch intoa conductive pocket, in accordance with an embodiment of the currentdisclosure;

FIG. 1g is a simplified illustration of a piece of parachute fabriclayered over a Faraday cage, which is layered over a seam of aparachute, where one or more conductors are in the seam and branch intoa conductive pocket, in accordance with an embodiment of the currentdisclosure;

FIG. 2a is a simplified illustration of a piece of parachute fabriclayered over a Faraday cage, which is layered over a seam of aparachute, where conductors are in the seam, in accordance with anembodiment of the current disclosure;

FIG. 2b is an alternative simplified illustration of a piece ofparachute fabric over a Faraday cage, which is layered over a seam of aparachute, where one or more conductors are in the seam, in accordancewith an embodiment of the current disclosure;

FIG. 3a is a simplified illustration of a piece of conductive fabricwrapped into a “S” shape to form two compartments separating one or moreconductive elements in each compartment, in accordance with anembodiment of the current disclosure;

FIG. 3b is an alternative view of the simplified illustration of a pieceof conductive fabric wrapped into a “S” shape to form two compartmentsseparating one or more conductive elements in each compartment, inaccordance with an embodiment of the current disclosure;

FIG. 3c is a view of the simplified illustration of a piece ofconductive fabric wrapped into a “S” shape to form two compartmentsseparating one or more conductive elements in each compartment which hasbeen flattened, in accordance with an embodiment of the currentdisclosure;

FIG. 3d is an alternative view of the simplified illustration of FIG. 3c, in accordance with an embodiment of the current disclosure;

FIG. 4a is a simplified illustration of a piece of conductive fabricwrapped into a “S” shape to form two compartments separating twoconductive elements in each compartment, in accordance with anembodiment of the current disclosure;

FIG. 4b is a simplified illustration of a piece of conductive fabricwrapped into a shape to form three compartments separating one or moreconductive elements in each compartment, in accordance with anembodiment of the current disclosure;

FIG. 4c is a simplified illustration of a piece of conductive fabricwrapped into a shape to form four compartments separating one or moreconductive elements in each compartment, in accordance with anembodiment of the current disclosure;

FIG. 5a is a simplified illustration of a piece of conductive fabricwrapped into a shape to form compartments threaded through a seam, inaccordance with an embodiment of the current disclosure;

FIG. 5b is a simplified illustration of a piece of conductive fabricwrapped into a shape to form compartments threaded through a seam, wherethe seam is covered by a conductive fabric, in accordance with anembodiment of the current disclosure;

FIG. 6a is a simplified illustration of a pouch off a seam, inaccordance with an embodiment of the current disclosure;

FIG. 6b is a simplified illustration of a pouch off a seam, whereconductive elements exit the seam into the pouch and other conductiveelements exit the seam, where the seam is covered by a conductivefabric, in accordance with an embodiment of the current disclosure;

FIG. 6c is a simplified illustration of a pouch off a seam, where theconductive elements exit the seam into the pouch and conductive elementscontinues down the seam, in accordance with an embodiment of the currentdisclosure;

FIG. 7 is a simplified illustration of a conductive elements goingthrough a fabric, in accordance with an embodiment of the currentdisclosure;

FIG. 8a is a simplified illustration of conductive elements goingthrough a seam in a parachute, in accordance with an embodiment of thecurrent disclosure;

FIG. 8b is an alternative simplified illustration of conductive elementsthrough a seam in a parachute, in accordance with an embodiment of thecurrent disclosure;

FIG. 8c is a simplified illustration of a conductive elements across aseam in a parachute, in accordance with an embodiment of the currentdisclosure;

FIG. 8d is an alternative simplified illustration of a conductiveelements across a seam in a parachute, in accordance with an embodimentof the current disclosure;

FIG. 9a is a simplified illustration of parachute fabric or materialwith a seam and stitches and conductive fabric folded into the seam fromboth joining pieces of fabric, protruding from the seam, providingcontinuity across the seam and provides a pad for conductor attachment,in accordance with an embodiment of the current disclosure;

FIG. 9b is a simplified illustration of parachute fabric or materialwith a seam and stitches and conductive fabric folded into the seam fromboth joining pieces of fabric, running across the seam, in accordancewith an embodiment of the current disclosure;

FIG. 10 is a simplified illustration of parachute fabric or materialwith a seam and stitches and conductive fabric folded into the seam fromboth joining pieces of fabric, protruding from the seam and providingcontinuity across the seam, in accordance with an embodiment of thecurrent disclosure;

FIG. 11 a simplified illustration a data collection network, inaccordance with an embodiment of the current disclosure;

FIG. 12 an alternative simplified illustration a data collectionnetwork, in accordance with an embodiment of the current disclosure;

FIG. 13 a simplified illustration a parachute, in accordance with anembodiment of the current disclosure;

FIG. 14a is a simplified illustration of a parachute, in accordance withan embodiment of the current disclosure;

FIG. 14b is a simplified illustration of a conductive network, inaccordance with an embodiment of the current disclosure;

FIG. 14c is a simplified illustration of a conductive network on aparachute, in accordance with an embodiment of the current disclosure;

FIG. 14d is a simplified illustration of a conductive network on aparachute, where the conductive network is covered by a conductivematerial, in accordance with an embodiment of the current disclosure;

FIG. 15a is a simplified illustration of a parachute, in accordance withan embodiment of the current disclosure;

FIG. 15b is a simplified illustration of sensors in network, inaccordance with an embodiment of the current disclosure;

FIG. 15c is a simplified illustration of a conductive network on aparachute with conductive elements in the seam of the parachute, inaccordance with an embodiment of the current disclosure;

FIG. 15d is a simplified illustration of a conductive network on aparachute, where the conductive network is covered by a conductivematerial, in accordance with an embodiment of the current disclosure;

FIG. 16a is a simplified illustration of a parachute, in accordance withan embodiment of the current disclosure;

FIG. 16b is a simplified illustration of a conductive network, inaccordance with an embodiment of the current disclosure;

FIG. 16c is a simplified illustration of the conductive network of FIG.16b threaded through the seam of FIG. 16a of the parachute of FIG. 16a ,in accordance with an embodiment of the current disclosure;

FIG. 16d is a simplified illustration of a conductive network on aparachute, where the conductive network is covered by a conductivematerial to form a Faraday cage, in accordance with an embodiment of thecurrent disclosure;

FIG. 17a is a simplified illustration of a parachute, in accordance withan embodiment of the current disclosure;

FIG. 17b is a simplified illustration of a conductive network, inaccordance with an embodiment of the current disclosure;

FIG. 17c is a simplified illustration of a conductive network on aparachute, in accordance with an embodiment of the current disclosure;

FIG. 17d is a simplified illustration of a conductive network on aparachute, where the conductive network is covered by a conductivematerial to form a Faraday cage, in accordance with an embodiment of thecurrent disclosure;

DETAILED DESCRIPTION

Previously, successful attachment and integration of an autonomoussensor system contained on a parachute had not been successfullyaccomplished. Conventionally, high static environments have causedtrouble for conductive networks. Conventionally, previous networks forparachutes either failed due to packing of the parachute, staticelectricity, or problems associated with the use and or folding of theparachute. Previously, discrete conductive networks could not befeasibly incorporated into the fabric weave if the fabric issubsequently processes through rollers (calendering), high causticchemical washes, or other processes where the conductor could bechemically or mechanically altered or the dimension differences betweenthe conductor and the fabric thread lead to damage to the equipment,threads or conductors.

According to NASA the static charge build up on a parachute surface isnominally 25,000 volts. In many embodiments, use of Faraday cage mayprevent a static discharge event from of destroying sensors in aconductive network. In some embodiments, a charge on a Faraday cage maydissipated either through a discharge lead or through the grounding ofthe payload of a parachute upon landing. Typically, the force exerted ona parachute during opening can be nominally between 3 Gs and 9 Gs withextreme/hazardous cases up to 12 Gs. Generally, the force during packingis significant in order to pack the folded parachute into a smallpacking container. Conventionally, packing includes pounding and sittingon the parachute to fit the parachute into a packing container. In manyembodiments, securely attaching a conductive network to a parachute mayenable a conductive network to survive packing and deployment. In mostembodiments, strategically placing sensors to reduce the amount of shockto which they are subjected may also help ensure survivability inpacking and deployment. In certain embodiments, packing a parachutefabric so it acts as a cushioning media may also help survivabilityduring packing and deployment.

The Unites States Army recognized the inability to create conductivenetworks on parachutes in the Small Business Innovation (SBIR) ResearchTopic A151-063, Conductive Networks for Parachute Fabrics. This SBIRrecognized that there had been a failure to create a conductive networkon a parachute and that there is a need for such a technology. TheUnited States Army, in awarding a Phase II SBIR to the inventor(Principal Investigator) listed on this application has recognizedsuccess of the techniques of the instant disclosure in providing afunctioning conductive network. Further, generally parachutemanufacturers believed a conductive network, with sensors, attached to acanopy was not possible.

Embodiments of the current disclosure provide a tested and provensolution to creating a conductive network on a parachute. Furtherembodiments of the current disclosure, enable connecting a network to ahigh static environment. Many embodiments of the current disclosureenable a conductive network on a material, such as cloth, that is ableto withstand repeated folding and unfolding of the material in additionto large amounts of static discharge and other ElectromagneticInterference (EMI). In certain embodiments the electrical network mayhave various bus configurations: I²C, SPI, CAN bus, differential I²C,three wire. As used herein, I²C may mean Inter-Integrated Circuit. Asused herein, SPI may mean Serial Peripheral Interface. As used herein,CAN bus may mean Controller Area Network.

In certain embodiments, the current disclosure may enable a conductivenetwork for a parachute. In some embodiments, the current disclosure mayenable a process to incorporate a conductive network onto parachuteswithout harming the parachute fabric or sensors of a conductive network.In most embodiments, the current disclosure may not inhibitfunctionality of the parachute. In most embodiments, the currentdisclosure may enable sustaining parachute packing, and deploymentsequence of parachute drop, opening, descent and landing, where theparachute has a conductive network.

In some embodiments, the current disclosure may enable integration anddeployment of sensor and communication. In certain embodiments, thecurrent disclosure may enable a Conductive Network for Fabrics. In manyembodiments, the current disclosure may enable conductor and networkselection. In some embodiments, this disclosure may present a conductivenetwork and associated sensors associated with an embodiment and dataassociated with such an embodiment which survived multiple drops forwhich data was collected.

In certain embodiments, the current disclosure may enable a conductivematerial to be enclosed in a Faraday cage. In some embodiments, aconductive element enclosed in a Faraday cage may be used to create andor protect conductive network on a parachute. In many embodiments, thecurrent disclosure may enable creation of a conductive network on aparachute. In certain embodiments, the current disclosure may enable arobust conductive network on a parachute to withstand packing, rigging,and multiple parachute drops. In many embodiments, the currentdisclosure may enable a conductive network attached to a parachute thatis connected to sensors or other electrical devices. In someembodiments, a conductive network may have one or more stress andtension relief coils.

As used herein, a conductive network may refer to a combination ofconductive elements, sensors and other electrical devices. In someembodiments, a conductive element may include wires, conductivematerial, conductive fabric, conductive threads or conductive yarns. Incertain embodiments, conductive networks may consist of conductiveelements, such as wires, conductive material, conductive fabric,conductive threads or conductive yarns, interconnections and networkbranches, conductor attachment methods such as conductive threads,conductive epoxy, solder, mechanical crimps, mechanical compression,Faraday cage elements for shielding such as conductive fabrics,conductive braids, conductive pouches, and may include sensor andmicroprocessors or microcontrollers and data capture and storage.

In certain embodiments, a conductive element may be a wire or conductivefabric used as a conductor. In many embodiment, a conductor element maybe a metalized fiber. In some embodiments, a fabric of a conductiveelement may be nylon or KEVLAR® or other fiber cores. In at least someembodiments, a conductive fabric may be a metalized fabric. In certainembodiments a conductive fabric may be plated or coated with a metal. Incertain embodiments, a base fabric of a conductive fabric may be ripstopnylon. In some embodiments, a device may be an active electricalcomponent. In other embodiments, a device may be a passive electricalcomponent. In many embodiments, a device may be a sensor. In certainembodiments, a device may be an actuator. In some embodiments, a devicemay be a motor. In further embodiments, a device may be amicroprocessor. In certain embodiments, a device may be amicrocontroller. In many embodiment, a device may be electricalcomponent. In further embodiments, a device may be an electromechanicalcomponent. In some embodiments, an insulator may be nylon fabric. Inother embodiments, an insulator may be tape. In certain embodiments, aninsulator may be any type of fabrics. In some embodiments, an insulatormay be any non-conductive material.

In certain embodiments, a conductive network within a Faraday cage maybe preassembled and attached to an internal portion of a parachutefabric. In some embodiments, a network may be attached to the top sideof a parachute. In some embodiments, a network may be attached to thebottom side of a parachute. In some embodiments a network may beattached to or inside of a seam of the parachute. In many embodiments,an internal portion of a network may be a seam of a parachute. In someembodiments, a conductive network within a Faraday cage may bepreassembled and attached to an external portion of a parachute fabric.In some embodiments, a Faraday cage attached to an external portion of aparachute fabric may be covered by cloth.

In certain embodiments, a conductive network may be attached byadhesives. In other embodiments, a conductive network may be attached bysewing. In further embodiments, a conductive network may be attached bysewing and adhesives. In further embodiments, a conductive network maybe attached by double sided tape. In some embodiments, a conductivenetwork may be installed in a seam of a parachute. In certainembodiments, a Faraday cage may be incorporated within a seam of anetwork. In other embodiments, a Faraday cage may be placed on a seam ofa network. In further embodiments, a Faraday cage may be placed on theoutside of a network. In some embodiments the conductive network maybeinterior to the parachute, in a cell or under the top skin. In furtherembodiments, a Faraday cage may be placed over a seam containing theconductive network.

In many embodiments, a Faraday cage may be may be made from a conductivefabric. In some embodiments, conductive elements may be placed in insidea conductive fabric to create a Faraday cage shielding the conductiveelements. In certain embodiments, multiple conductive elements may beplaced within the conductive fabric. In further embodiments, aconductive fabric may have be folded into an “S” type shape. In manyembodiments, a conductive network may be incorporated into any knownseam stitching method. In certain embodiments, two or more conductiveelements may be included in each seam pocket.

In some embodiments, conductive fabric may be added to as part seam of aparachute. In many embodiments, a conductive fabric may enable aconductive network or conductive element to cross the seam of theparachute. In certain embodiments, a pouch may be attached to aparachute. In some embodiments, a pouch may be inserted into aparachute. In many embodiments, a conductive fabric pouch may be part ofa conductive network. In certain embodiments, a pouch may be made out ofa conductive material. In some embodiments, a pouch may be made out of aconductive fabric. In some embodiments, the pouch may be made out ofnon-conductive material. In some embodiments, the pouch may be made outof non-conductive material and covered with a conductive material orconductive coating. In other embodiments, the pouch may be made out of aconductive material.

In certain embodiments, a conductive network may be preassembled withina Faraday cage and attached to an external parachute fabric surface. Incertain embodiments, a conductive network may be preassembled within aFaraday cage and attached internal to parachute fabric surfaces. In someembodiments, a conductive network may be attached by adhesives. In otherembodiments, a conductive network may be attached by sewing. In furtherembodiments, a conductive network may be attached by a combination ofadhesives, tape and sewing. In some embodiments, a conductive networkmay be installed in seams of a parachute. In certain embodiments, aFaraday cage for a conductive network may be incorporated within a seamof a parachute. In others embodiments, a Faraday cage for a conductivenetwork may be incorporated on the external surface of the seam.

In many embodiments, a conductive network may maintain continuitythrough parachute seams. In certain embodiments, a conductive networkmay maintain continuity over parachute seams. In some embodiments, aconductive network may maintain continuity though seam stitches. In manyembodiments, an incorporated sensor may attach to the network throughdirect soldering the interconnections. In other embodiments, sensors orelectrical components may attach to the network using mechanicalinterconnects using conductive and nonconductive threads. In furtherembodiments, sensors or electrical components may attach to the networkusing conductive tape. In other embodiments, sensors or electricalcomponents may attach to the network using crimp connections. In someembodiments, sensors or electrical components may connect to the networkusing conductive epoxy and by tying and knotting conductive fibers. Insome embodiments, sensors or electrical components may connect to thenetwork using electrical connectors.

In certain embodiments, a network may be autonomous with sensors, powersupply, electrical components and memory for data collection. In someembodiments, a system may incorporate a communication system with othernetworks attached to the parachute or payload or ground stations. Inother embodiments, sensors or electrical components may be installedinline within the conductive network, in Faraday cage pockets or innon-Faraday cage configurations. In certain embodiments, a sensor orelectrical components may be used to sense physical changes to theparachute surfaces, structure, and surrounding atmosphere. In manyembodiments one or more strain relief mechanisms may be included formatching or compensating for different elongation properties of theparachute material. In some embodiments, a conductive network mayinclude strain relief loops. In other embodiments, a conductive networkmay include zigzag conductor paths for stretching. In some embodiments,a conductive network may include a conductor sliding within a Faradaycage. In some embodiments, a conductive network and Faraday cage whichencloses the network may slide as a unit on the surface of a parachuteand contained by parachute fabric.

In certain embodiments, optimal performance and reliability may requirea Faraday cage to protect from high electrostatic discharge caused bythe charge buildup on the parachute material during parachute pack anddeployment operations. In some embodiments, a conductive network may beassembled on the parachute or preassembled. In many embodiments, aFaraday cage may be any conductive material. In certain embodiments, aFaraday cage may be a conductive fabric. In certain embodiments, aFaraday cage may be a tape shielding which can provide an electricalshield around the conductors. In certain embodiments, the Faraday cagemay be made from conductive nanoparticle material. In certainembodiments, the nanoparticle material may enclose the conductivenetwork. In certain embodiments, the nanomaterial may be adhereddirectly to the parachute fabric. In certain embodiments, thenanomaterial may fully enclose the conductive network.

In some embodiments, external attachment of a conductive network mayinclude attachment of a complete network assembly—conductive network,sensors, power and memory, or electrical components and communication,which may be enclosed in a Faraday cage. In many embodiments, a networkmay be adhered and may be sewn to a parachute surface and enclosed bystrips of parachute fabric which are adhered/sewn to the parachutesurface. In certain embodiments, a network may include pouches forexternal accessibility.

In some embodiments, an electrical conductive network may be included inseams of an assembled parachute. In certain embodiments, an electricalconductive network may be attached on the surface of a parachute, on theunderside inner surface of the top skin of a parachute and/or on thevertical baffles within the parachute. Embodiments of the disclosure maybe applicable to any type parachute such as round, rectangular,elliptical and ram air configurations. In certain embodiments, a networkmay be applicable to any parachute fabric material, surface treatmentand permeability. Embodiments of the disclosure may be applicable topersonnel and payload airdrop parachutes and in principle is applicableto space recovery vehicle parachutes. In certain embodiments, aconductive network may also be installed during parachute manufacture asdiscrete components or as a kit. In some embodiments, a conductivenetwork may be a conductive thread coated with insulating material and aconductive material. In some embodiments, a conductive material may besilver. In other embodiments, a conductive material may be nickel. Infurther embodiments, a conductive material may be a combination ofnickel and silver. In some embodiments, a conductive material may be orinclude copper. In certain embodiments, a conductive material may be anylon thread coated with a conductive material. In many embodiments, aKevlar thread may be coated with a conductive material. In certainembodiments, a conductive material may be a non-conducting thread coatedwith a conductive material. In many embodiments, a polymer thread may becoated with a conductive material.

In some embodiments, sensors may be attached to the conductive networkof a parachute. In certain embodiments, a sensor may be a navigationaid, Inertia measurement unit, gyroscope, accelerometer, pressure,temperature, magnetometer, GPS or other types of sensors. In certainembodiments, conductor count may be any number which can be enclosed inthe Faraday cage. In many embodiments, a network in some cases may beinstalled in a parachute without a Faraday cage. In some embodiments, atopology of a network may be Inter-Integrated Circuit (I2C), three wire,two wire, Serial Peripheral Interface (SPI), Can bus, differential I2Cor other configurations.

In some embodiments, electromechanical devices may be attached to aconductive network of a parachute. In certain embodiments, anelectromechanical device may be an actuator or motor.

In certain embodiments, the current disclosure may enable integration ofan electro-textile conductive network by embedding it into the parachutecanopy to enable data and power transport to sensors and actuators. Insome embodiments, the current disclosure may enable integration of aconductive network into a parachute fabric for use in parachuteapplications. In a particular embodiment, the current disclosure mayenable integration into a PIA-C-44378 Type IV, zero porosity and othertype of parachute fabric. In many embodiments, a parachute fabric mayhave zero porosity. In many embodiments, a parachute fabric may havenon-zero porosity. In many embodiments, a parachute fabric may be coatedwith antistatic or silicon or other material. In many embodiments, aparachute fabric may be coated with other materials. In someembodiments, a parachute fabric may not have special coatings.

In certain embodiments, the current disclosure illustrates conductor andnetwork construction. In many embodiments, the current disclosure showsconfiguration and termination of a conductive network. In someembodiments, the current disclosure illustrates network orientation in aparachute. In further embodiments, it is shown how a conductive networksurvives mechanical and electrical testing, verification and validation.In certain embodiments, a primary candidate for conductor network designmay be Aracon. In some embodiments, Aracon may be placed inside aFaraday's cage. In many embodiments, Aracon may be used to carry signalsand power. In other embodiments, a metalized polymer fiber or thread maybe used for the conductive network.

In certain embodiments, a primary candidate for conductive networkdesign may enable interconnection methods. In some embodiments,interconnection methods may include soldering. In other embodiments,interconnection methods may include mechanical connections. In furtherembodiments, interconnection methods may include crimping. In furtherembodiments, interconnection methods may include conductive tape. Infurther embodiments, interconnection methods may include conductiveepoxy.

In some embodiments, the current disclosure may have an integratednetwork utilizing I²C based sensors. In some embodiments, the currentdisclosure may use electro-mechanical components in a network. In manyembodiments, the current disclosure may enable an in-parachute networksfor a ram-air parachute. In certain embodiments, the current disclosuremay enable an in-parachute network for an Intruder 360 parachute. Incertain embodiments, the current disclosure may enable an in-parachutenetwork for an MC-4 parachute. In many embodiments, the currentdisclosure may enable an in-parachute networks for a round or squareparachute. In certain embodiments, the current disclosure may enable anin-parachute network for a T-11 or T-10 parachute. In certainembodiments, the current disclosure may enable an in-parachute networkfor other types of parachutes. In a particular embodiment, sensorsattached to a network may record data to a memory card or double datarate (DDR) memory. In most embodiments, a sensor network on a parachuteaccording to the current techniques may survive multiple packing andunpacking of the parachute. In certain experiments of some embodiments,a conductive network remained attached, did not cause any visible damageto the parachute, and the sensors collected data during multiple drops.

In certain embodiments, a prototype demonstrated successful integrationof a conductive network into parachute fabric and parachute canopies. Inmany embodiments, intact networks and sensor electronics followingmultiple drops and successful data collection capabilities are enabledfor multiple drop tests of a parachute.

In certain embodiments, the current disclosure may enable a textilebased electronic network for use in parachute fabric. In certainembodiments, the current disclosure may enable a textile basedelectronic network for use in Army parachute fabric. In manyembodiments, the current disclosure may enable a textile basedelectronic network for use in commercial parachute fabric. In manyembodiments, the current disclosure may enable a textile basedelectronic network for use in sport parachute fabric. In mostembodiments, a textile based network enabled here in may maintainviability and stability across fabric seams and through repeateddeployment and recovery events. In a particular embodiment the currentdisclosure may enable materials and methods to integrate a conductivenetwork into PIA-C-44378 Type IV and other parachute fabrics.

In many embodiments, the current disclosure may enable deployment ofsensor and communication platforms by integrating conductive networksinto the parachute fabric design and canopy manufacture. In mostembodiments, the current disclosure enables a textile based conductivenetwork. In many embodiments, a textile network may have acceptablecontinuity across fabric seams. In most embodiments, a textile networkmay survive multiple refolding, deployments and recovery operations. Inmost embodiments, a textile network may meet the electrical performanceand interconnect requirements for signal, data and power transmission.In many embodiments, the parachute conductive network ground may begrounded to a Faraday cage.

In most embodiments, the current disclosure may enable a textile networkthat maintains fabric properties when modifying the parachute with aconductive network. In many embodiments, the current disclosure mayenable a textile network that ensures a durable and ruggedized networkcapable of withstanding parachute opening and repeated packing andhandling. In most embodiments, the current disclosure may enable a costeffective network in conjunction with unique parachute seams. In mostembodiments, the current disclosure considers all conductive networkcomponents: conductor, conductive fiber, connectors, interconnectionsand network attachments/integration.

In some embodiments, the current disclosure may enable design,development, and testing of conductive networks that maintain acceptablecontinuity across fabric seams and throughout the parachute network. Inmost embodiments, the current disclosure may enable a network thatsurvives multiple refolding, deployment, and recovery operation. In manyembodiments, the current disclosure may meet electrical performance andinterconnect requirements for data and power transmission. In certainembodiments, the current disclosure may enable ram air parachute droptest details of the successful verification of initial conductivenetwork designs (network and electronic survivability and successfuldata collection).

In many embodiments, the current disclosure may cover the following:

1. Conductor Network Design/Development (Components)

2. Interconnections Design Development (Components)

3. Integrated Network Design/Development

4. Network Tests—Electromechanical Conductive Network

In certain embodiments, the current disclosure may illustrate testmaterials and methods to integrate a conductive network into PIA-C-44378Type IV or any parachute fabric. In certain embodiments, the currentdisclosure may present a design and development of conductor(s) to meetthe voltage, current, signal to noise and EMI requirements for aconductive network in a high static environment.

In many embodiments, the current disclosure may meet the requirements ofthe Berry Amendment with selected conductors. In some embodiments,discrete conductors may be used as components of the network. In manyembodiments, conductive fibers may provide a network of discrete linesthrough proper sizing of fiber bundles (denier). In some embodiments,fibers may have the current carrying capacity to address multiple powerlevels, data transmission, and signal to noise (S/N) requirements.

In a particular embodiment, target characteristics for the conductivenetwork include the metrics listed in Table 1:

TABLE 1 Sample Conductive Network Requirements Application RequirementsData mV-5 V DC @ 500 mA Power 25 V DC @ 1A Actuator 3 V @ 150 mA and 48V @ 6000 mA

In some embodiments, conductor components may include Aracon® brandmetal clad fibers from Micro-Coax. In other embodiments, conductorelements may include Shieldex® Conductive Yarns from V TechnicalTextiles. In some embodiments, emerging conductor products may be usedto ensure optimal design for voltage, current, signal to noise, and EMIrequirements.

Generally, Aracon® brand metal clad fibers are manufactured byMicro-Coax, Inc. Aracon® fibers are lightweight, flexible, and durable.Usually, Micro-Coax manufactures microwave cables, cable assemblies andmetalized DuPont™ KEVLAR®, ARACON® fiber for EMI shielding. In certainembodiments, ARACON® fibers may be braided resulting in a 75% weightreduction versus metal braid. Conventionally, V Technical Textiles Inc.offers a number of products for discrete conductors (Shieldex®) and forshielding metalized fabrics/tapes. In most embodiments, different typesof conductive fabrics may be used.

In certain embodiments, wire tensile may use a control of 24 gaugeinsulated solid copper wire, Shieldex 235/34 2-ply TPU coated conductorstrands, Aracon XS0400E-018 Bare Conductor, and Aracon XN0400F-JP-BGBlue PFA Jacket. In some embodiments, a half inch-wide silver coatedself-adhesive nylon tape and Aracon XN0400F may be used under a 3 ampload current.

In a particular embodiment, wires were tested for current carrying andsized into appropriate bundles to improve current carrying capacity. Inthis embodiment, Shieldex (235/34) required four (4) conductors to meeta 0.5 Amp current carrying capacity. In this particular embodiment, two(2) Aracon bare conductors, single ply successfully carried 1 Amp. Inthis particular embodiment, Two (2) Aracon 3 ply insulated conductorstested okay for carrying up to 6 Amps. In this particular embodiment,the surface temperature of the conductors was also monitored todetermine if the temperature at the desired current level was within theparachute material operating range.

In this particular embodiment, the conclusion from the initial conductortesting is that all samples meet the low current requirements. In thisparticular embodiment, both Aracon products meet the 1 Amp requirementsand the 3 ply insulated Aracon conductors meet the 6 Amp requirement. Inthis particular embodiment, there was a challenge to deliver sampleconductors that meet these current requirements.

Table 2 lists sample embodiments of attachment methods for joining theconductive network to the parachute fabric. In these embodiments, boththrough and across seam attachments were successfully incorporated.

Embodiments of attachment Methods Method Processing Original ProsOriginal Cons 1. Adhere Attached the conductive Can be attached toFinished fabric is network to the finished any type parachute treated soadhesion fabric using an adhesive Strategic placement may be an issue Ahot melt method may be required adding to required processing steps 2.Tape - Stitch or adhere a tape or Can be attached to Cost stitch orshield with conductive any type parachute Could affect parachute adherefiber attached or enclosed Strategic placement fabric properties. tapeto a gore or finished Handling, stitching parachute procedures andprocesses are within current manufacturing SOPs EMI protection 3. SeamRun the conductive fiber Easy to accomplish, Large conductor Integrationwithin the seams little or no impact to volume could be an parachuteissue performance Less flexibility of transverse seams or strategicplacement of exit seam at branch sensors point

In some embodiments, a conductive network may be attached to the surfaceof a parachute using adhesion. In a particular embodiment, anelectro-textile conductive network was adhered to the “zero-porosity”top skin of the Intruder 360 parachute. In this embodiment, theconductive network was applied with a special process of adhesion. Inthis embodiment, the network is embedded in additional parachute fabric.In alternative embodiments, fabric patches may be sewn to Intruderfabric. In certain embodiments, stitching or adhering tape can beattached to any type parachute and may be strategically placed. In someembodiments, an electro-textile conductive network may be adhered to theunderside of “zero-porosity” top skin of the Intruder 360 parachute. Insome embodiments, an electro-textile conductive network may be adheredto the baffles of lower surface of the ram air canopy. In someembodiments, an electro-textile conductive network may be adhered to anysurface of the canopy of a MC-4 parachute

In some embodiments, running conductive fiber within seams may be easyto accomplish, may have little or no impact to parachute performance,may not have to transverse seams, and may exit the seam at branch point.In other embodiments, for some network configurations, a conductor mayexit the seam between stitches. In certain embodiments, using the seamas a conduit is a preferred method for the majority of network pathways,especially for parachutes with wide seams. In some embodiments, theconductive network may be installed in a T-11 or other parachute seam.

In certain embodiments, epoxies were evaluated for use in terminatingconductor interconnections and to improve conductivity acrossmechanically conductive surface transitions. In many embodiments,epoxies may be used to terminate conductor interconnections and toimprove conductivity across mechanically connected conductive surface toconductive surface transitions. In certain embodiments, solderingmethods proved repeatable and reliable for interconnects. In someembodiments, soldering with shrink tubing enables termination betweenconductors, conductor branches and sensor termination. In certainembodiments, ultrasonic welding may be used for connections.

In some embodiments, conductive tape may be used for crossing seams andmay be a viable option for some applications. In certain embodiments,tape strips may be attached to both adjoining parachute sections andwhen folding the sections the tapes physically touch, thus making acontinuous conductor across the seam. In many embodiments, the seam maybe stitched and the conductive tape strips are attached to each other.

In a particular embodiment, an inter-integrated circuit (I²C) networkscheme may be used with two wire communication with I²C devices and atwo wire power bus for prototype demonstrations. In the particularembodiment, the network is located in the seam and the terminations tothe sensors use conductive tape which branches off the networkconductors and exit the seams.

In a particular embodiment, there may be several different networkdesigns including conductive tape along a seam, conductive tape througha seam, and shielded conductors inserted directly into a seam. In aparticular embodiment, a modular network is attached to the surface of aparachute fabric and may be located anywhere on the parachute. In aparticular embodiment, a 30 foot modular I²C network was attached to anIntruder parachute and dropped three times from an aircraft. In aparticular embodiment, the network, parachute, and sensors all survivedthe drops without any visible mechanical damage or functional electricalfailure.

In a particular embodiment, I²C sensors reviewed for conductive networkvalidation included pressure, acceleration, rotation, and temperaturesensors. In a particular embodiment, these sensors proved valuable invalidating the network. In a particular embodiment, electrical andmechanical testing of integrated fabric samples was completed. In aparticular embodiment, test methods were developed to completeinterconnect testing of the Aracon Blue 3-ply wire, seam insertiontesting, and seam overlap/pass-through/bypass testing. In someembodiments the network may be two wires connected for serial transmitand receive data transfer. In many embodiments, power conductors may berun parallel to the signal wires or routed through a separate path.

In certain embodiments, stripped wire end may be soldered together. Inother embodiments, stripped wire end may be glued together withChemtronics silver epoxy. In some embodiments, stripped wire ends may beglued together with Creative Materials silver epoxy or other conductiveepoxies. In certain embodiments, stripped wire ends may be mechanicallycrimped with metal ferrule. In alternative embodiments, stripped wireends may be connected with metalized conductive tape. In furtherembodiments, wire may be spliced into the cable to simulate I²C drops toindividual sensors. In alternative embodiments, cyclic flexure testingfor accelerated life cycle testing may be tested.

In some embodiments, I2C drops (interconnections) may be accomplished bysoldering leads to network bus lines to connect individual sensors ordevices.

In some embodiments, individual wires may be bundled together andwrapped in conductive tape to form an EMI shielded ribbon cable and maybe inserted into a seam. In other embodiments, an exposed strip ofself-adhesive tape may be used to fasten conductors to parachute fabric.In many embodiments, conductors may be systematically spaced out inorder to enhance thermal performance. In certain embodiments,consideration of airflow and effect on thermal performance may beincluded. In many embodiments, twisted pairs may be bundled insideconductive tape in order to enhance noise immunity.

In many embodiments, seam overlap may be used. In a certain embodiment,sewing over the wires with one stitch over each wire may be used. Inother embodiments, sewing over the wires with one stitch over all of thewires (long stitch) may be used. In many embodiments, sewing over thewires with one stitch over multiple wires (two or more long stitches)may be used. In certain embodiments, incorporating a grommet or buttonhole may be used to allow wires to escape, pass over the seam, and thenreenter a seam. In other embodiments, incorporating interconnect wire toconductive tape where the tape passes through the sewn seam may be used.In alternative embodiments, results of test methods to testsurvivability and maintenance of integrity of EMI shield through theseams/interconnects may be used. In other embodiments, the results oftensile tests of parachute fabric to establish baseline properties maybe used.

In a particular embodiment, Fabric strips were mechanically testedfollowing ASTM D5305-11 Standard Test Method Force and Elongation ofTextile Fabrics (Strip Method). In a particular embodiment, samples weretested in the warp and fill direction. In a particular embodiment, bothfabric only and wire and fabric were tested.

In a particular embodiment, flex testing on conductors to evaluate longterm stability and survivability in parachute environments (packing,unpacking, opening, landing) was completed. In a particular embodiment,a cam plate design may allow for zero sliding contact between the pinsand the wire. In a particular embodiment, seam thermal testing wascompleted to verify parachute network integrity even during minimalconductor heating.

In a particular embodiment, one half of a network was integrated into aseam and the other half was attached to the top skin of the parachute.In the particular embodiment, half of the network was fully enclosed inan EMI shield and the other half was not completely shielded. In theparticular embodiment, both halves incorporated the same types ofsensors for comparison. In the particular embodiment, the integrity ofthis network was tested before and after packing. In the particularembodiment, the parachute was also dropped and thrown around toinvestigate basic survivability. In the particular embodiment, theconductor system used in the network was also incorporated into the seamof a Nitro 150 parachute made by Hyper USA. In the particularembodiment, two Aracon insulated conductors were inserted into the seamof a parachute. In the particular embodiment, a test was completed totest to see if any friction burns would occur due to the insulatedconductor rubbing against the fabric during a jump (packing, opening,landing). In the particular embodiment, the lines were installed in thebottom skin center cell, one line away from the tail. In the particularembodiment, a taped patch on the parachute was verified to showprefabricated networks attached following production are a viableattachment method. In the particular embodiment, the taped pouchsurvived the parachute drop/jump with no notable damage. In someembodiments, a portion of the conductive network may be outside theFaraday cage and unshielded. In some embodiments, the sensor is insertedin a Faraday cage. In some embodiments, the sensor is inserted in anon-conductive pouch.

In certain embodiments, the current disclosure may provide a design ofconductor(s) to meet the voltage, current, signal to noise and EMIrequirements for a conductive network in a high static environment. Insome particular embodiments, conductors for a conductive network may beselected based on subject matter expertise, available literaturedocumenting electrical and mechanical performance, availability, andcompliance with the Berry Amendment. In some embodiments, conductorswere tested against the baseline parachute material (PIA-C-44378 TypeIV).

In some embodiments, wire tensile testing documented the breaking forceof the wire. In a particular embodiment, wires were tested for currentcarrying capacity and sized into appropriate bundles to improve currentcarrying capacity. In a particular embodiment, Shieldex (235/34)required four (4) conductors to meet a 0.5 Amp current carryingcapacity. In the particular embodiment, two (2) Aracon bare conductor,single ply successfully carried 1 Amp. In the particular embodiment, two(2) Aracon 3 ply insulated conductors tested okay for carrying up to 6Amps. In the particular embodiment, samples met the low currentrequirements. In the particular embodiment, both Aracon products meetthe 1 Amp requirements and the 3 ply insulated Aracon conductors meetthe 6 Amp requirement. In the particular embodiment, the insulatedAracon, conductor was flexed over 100 times with no indication ofconductor resistance changes during the test (resistance verified beforeand after testing). In some embodiments, surface temperature wasmonitored to determine if the temperature at the desired current levelwas within the parachute material operating range. In a particularembodiment, Conductive network temperatures remained at acceptabletemperatures. In a particular embodiment, at 6 amps, the insulationsurface temperature was approximately 165° F.

In most embodiments, adhesives used in a conductive network survivedparachute multiple drops. In many embodiments, conductive tape sewn ontoparachute fabric proved acceptable for EMI compatibility. In certainembodiments, stitching or adhering tape may be attached to any typeparachute and can be strategically placed. In most embodiments, runningthe conductive fiber within the seams may be easy to accomplish, hadlittle or no impact to parachute performance, did not require traversingseams, and the conductor was able to exit the seam at branch points. Inmany embodiments, using a seam as a conduit may be the preferred methodfor the majority of network pathways, especially for parachutes withwide seams. In almost all embodiments, each attachment methods survivedmultiple drops and did not visually appear to damage the parachute.

In an embodiment, conductive paths across a seam using conductivefabric/tape may be used for termination. In certain embodiments,interconnect termination may include epoxy. In certain embodiments,interconnect termination may include contact connections. In certainembodiments, interconnect termination may include sewn connections. Incertain embodiments, interconnect termination may include solderconnections. In certain embodiments, interconnect termination mayinclude crimp connections. In certain embodiments, interconnecttermination may include ultrasound connections. In certain embodiments,interconnect termination may include mechanical splice. In certainembodiments, interconnect termination may include mechanical tying orknotting the conductors. In certain embodiments, interconnecttermination may include electrical connectors.

In most embodiments, mechanical termination by sewing over conductivefibers to conductive fiber or fabric tape may provide a goodinterconnect selection. In certain embodiments soldering may be used asa connection point. In many embodiments, Aracon may be used as aconductor. In some embodiments, crimp terminations may be used as atermination. In some embodiments, ultrasound connections may be used fortermination. In other embodiments, mechanical splices may be used fortermination. In other embodiments, conductive tape may be used for aconnection. In some embodiments, conductive tape may be used fortermination.

In some embodiments, soldering may be the preferred choice of conductorto conductor and conductor to devices/sensors termination. In otherembodiments, crimp connections may be used. In some embodimentssoldering directly to the sensor interconnections or breakout board mayavoid adding another failure point. In certain embodiments, adetermination is based on experience with aviation wiring where cableand harness failure frequently occur near connectors.

In some embodiments, mechanical contact, epoxy, and sewing may beoptions for conductor to conductive tape interconnections. In certainembodiments, sewing a conductor to the conductive tape may form anelectrical connection by compressing the two conductors together. Insome embodiments, a mechanical bond may be reinforced using epoxy. Inmany embodiments, an epoxy application may be more involved—two partepoxy, cure time, cure temperature and epoxy adds thickness andincreases the cross section of the bonded area.

In certain embodiments, soldering may be chosen for a conductive networkas solder may have a low cost, proven reliability/durability, mechanicalstrength, the existing workforce knows how to use/repair solderedconnections, and there may be no special equipment or supply chainrequirements.

In some embodiments, Epoxy and sewing may be considered options forconnections to conductive tape. Historically, soldering has proven to bemore reliable than crimp connections (it is considered a permanent typerepair). In most embodiments, the intent of the conductive network maybe to be maintenance free and solder may present the best solution forreliability over the sensor/parachute life.

In some embodiments, Conductive tape may be selected for use betweenstitches as a prime method for crossing seams. In a particularembodiment, a conductive network was demonstrated using three BlinkMLEDs. In this particular embodiment, this successfully documented thecommunication of a two wire system with each device, reducing the totalnumber of conductors for the network. In a particular embodiment, twopower wires may be run separately in the 2-wire I²C network.

In a particular embodiment, a conductive network path of conductive tapewas demonstrated through, into, and pass through of the seam. In aparticular embodiment, this was verified by connecting BlinkMs to theconductive tape which passed through and out of the seam. In aparticular embodiment, internally, the conductive tape was connected tothe Aracon, 2-wire system.

In a particular embodiment, 3-wire systems were verified. In aparticular embodiment, for 3-wire systems, the potential limitations forparachute integration may include the physical size (volume) of the wireand the seam in which it is enclosed. In a particular embodiment,limitations caused by physical size may be overcome by attaching theconductive network on top of a seam. In a particular embodiment, smallergauge Aracon wire or other conductors, adequate for signal wires andsmaller currents may be used to further reduce weight. In a particularembodiment, limitations caused by physical size may be overcome byattaching the conductive network on top of a parachute canopy.

In a particular embodiment, conductors may be shielded with conductivenylon tape. In certain embodiments, the conductive tape may directlywrap the wires and/or it may form top and bottom covers over the wireseither within or exterior to the seam which houses the conductors. Insome particular embodiments, interconnections may be located in pouchesor pockets, which may be covered with a conductive fabric or made ofconductive fabrics. In some embodiments, shielding exceptions mayinclude magnetometers pressure sensors and RF devices. In someembodiments, shields enclosing the conductors may be connected to theconductive pockets to form a Faraday cage.

In exemplary embodiments, different conductive networks were installedon different types of parachutes and tested. In these embodiments, themakeup of the conductive networks varied as described herein. In theseembodiments, the attachment of the networks varied as described herein.In these embodiments, the types of parachutes varied as describedherein.

In a particular embodiment, a 30 foot modular I²C sensor (5) network wasinstalled on the top skin of an Intruder ram air parachute, a two sensorSPI network was installed on an Intruder parachute, and an in seam I²Cnetwork was installed on a MC-4 parachute. In these particularembodiments, each of these installed networks and parachutes were airdropped and survived.

In a particular embodiment, fabric strip mechanical testing was used toverify integrity and optimize the conductive network. In a particularembodiment, testing indicated that to achieve tension only on theparachute fabric (rather than tension on the conductors), theinstallation design needed to include wire network strain relief. In aparticular embodiment, relief strain was accomplished through a coilloop of wire at the ends of a network. In a particular embodiment, eachlength of wire requires an excess length to account for the differencein elastic modulus between the aramid base fiber in the Aracon wire andthe nylon parachute. In a particular embodiment coiled strain relief areintegrated into their parachute demonstrations utilizing additionalwire, coiled in pocket type patches. In many embodiments, a coilstress/strain relief system may relieve stress on the entiresystem—conductors and interconnections.

In some embodiments, the conductive network may be loosely attached to aparachute surface, enclosed and covered by a piece of parachute fabricand allowed to move with parachute elongation.

In a particular embodiment, Flex testing (100 cycles) documented nomeasurable difference in resistance and no visible damage to the wirejackets using the conductive network techniques described herein. Insome embodiments, two wire and four wire seam heating tests alsodocumented successful integration of networks with acceptable parachutefabric temperature ranges.

In a particular embodiment, a conductive network was successfullyintegrated into parachutes/parachute fabric and in the seam. In aparticular embodiment, I²C networks, a 3-wire sensor example, aconductive network through the seam, and a conductive network in theshield were integrated into a parachute.

In many embodiments, live testing of a conductor in the seam of thesports parachute proved successful and no friction burns were noted. Inmost embodiments, based on conductor placement indicator lines drawnafter installation and reviewed after the drop, the conductor did notappear to shift during the drop process.

In certain embodiments, a MC-4 parachute packed and unpacked severaltimes which helped to verify network integrity. In these particularembodiments, the parachute was packed and unpacked and flew in theluggage storage compartment of a commercial plane. In these particularembodiments, during the testing, the team unpacked the parachute andverified functional network operation (through functional sensors) andsuccessful data collection.

In a particular embodiment, integrated prototype systems were fabricatedand installed on an MC-4 and Intruder 360 parachute. In a particularembodiment, these conductive networks with sensors were installed on theparachutes and drop tested. In a particular embodiment, post recoveryevaluation indicated no damage occurred to the parachute, conductivenetwork, or sensors.

In most embodiments, through a series of mechanical and electrical testsas well as the real world drop testing of parachutes, feasibility of aconductive network integrated into a parachute canopy using thetechniques described here were confirmed. In many embodiments, thecurrent disclosure may enable an electronic conductive network to enablea smart parachute.

In many embodiments, sensors and actuators, as part of a conductivenetwork, may improve the precision drop of cargo, optimize paratroopertraining, and enhance manned parachute steering capabilities. In someembodiments, the current disclosure may enable the placement of sensoranywhere on a parachute by attaching interconnect devices on a parachutevia the conductive network. In most embodiments, the current disclosuremay enable integration of electro-textile conductive networks intoparachute canopies. In some embodiments the conductive network may beinstalled on the inner surface.

In certain embodiment, the current disclosure may identify and solveissues with effective shielding, grounding, networks across panels, anddemonstrating sufficient flexibility and strength of the network. Inmany embodiments, a parachute network may not interfere with parachuteoperations while maintaining electronic integrity of the circuitry. Inmost embodiments, the current disclosure may enable an electronicconductive network to enable a smart parachute.

In some embodiments, the current disclosure enables conductivity acrossseams, mechanical and electrical integrity, and survivability during airdrops and the effects of parachute packing, deployment, opening, glide,and landing. In certain embodiments, preliminary evaluation of airdropsusing conductive network-modified parachutes described herein indicatesthat the parachutes mechanically survive handling and parachute dropsequences and there was no damage to the parachutes or conductivenetworks. In these experiments, the electronics (sensors) attached tothe conductive networks on the parachutes also survived the pack anddeployment operations and functioned after the drop.

In tested embodiments, the networks maintained acceptable continuityacross the fabric seam and throughout the parachute network. In thetested embodiments, the network survived multiple packing and unpacking,deployment, and recovery operations. In the tested embodiments, theconductive network also met the Army's electrical performance andinterconnect requirements for data and power transmission.

In certain embodiments, the current disclosure enables a functionalconductive network by refining the network for full scale incorporationon both round and ram air parachute canopies.

In many embodiments, the current disclosure enables subsystems of anetwork including networked fabric and LSc-2 seamed prototype(s) inaccordance with the objective to integrate electro-textile conductivenetworks into parachute canopies.

In most embodiments, the current disclosure may enable procedures,components, and techniques to fabricate a network; design modularconductive networks for applications which require the network in a seamand through seams, on the top surface of the canopy and below the topcanopy; and conduct laboratory and shop tests to verify survivabilityand functionality followed by full-scale parachutes deployed from anaircraft in an airdrop environment.

In certain embodiments, a matrix of target characteristics and testsequences of a parachute with electronic conductive network and settargets for conductive network may be shown below.

Application Requirements Data mV-5 V DC @ 500 mA Power 25 V DC @ 1 AActuator 3 V @ 150 mA and 48 V @ 6000 mA

In certain embodiments, the current disclosure enables a network thatmay meet the electric current levels specified in the table and enableoptimization of network configurations for different networkarchitectures. In many embodiments, a parachute mapping of the networkshowing the location and termination points may be provided. In certainembodiments, an I²C network with branches for multiple sensors, an SPInetwork for short distances—microcontroller to sensors, and a three wiresensor conductor run may be presented. In many embodiments, longconductive networks may include signal conditioning circuitry. In manyembodiments, a conductive network may include buffers, drivers, booster,or other electronic devices to improve signal integrity and improvesignal to noise ratios.

In certain embodiments, representative functional samples of an I²Cconductive network in a seam and a modular conductive network forattachment on interior or exterior parachute surfaces are enabled. In aparticular example embodiment, the capability to cross panels within theseam of the MC-4 parachute was documented.

In certain embodiments, installation techniques for in-seam conductivenetworks may be labor intensive and difficult to totally shield(complete Faraday cage). In some embodiments, these techniques may beapplied to the MC-4 parachute and may be modified for other parachutessuch as the T-11 or other type parachutes.

In some embodiments, a process for fabricating the conductive shieldwhich separates the power and signal conductors may be a manual process.In some embodiments, kitting operations to fabricate modular conductivenetworks at improved production rates and with consistent quality may beenabled.

In some embodiments, materials used to fabricate the conductive networkand sources specifically for shielding the conductors (Faraday cage) maybe used and enabled to meet the Berry Amendment or customer specificrequirements.

In certain embodiments, data from air drop tests of specific confirmedsuccessful integration of conductive networks (including confirmation ofsurvivability of sensors for multiple drops) using the techniquesdisclosed herein

In a particular embodiment, a pressure sensor as part of the conductivenetwork was attached to an Intruder 360 parachute. In this exampleembodiment, this sensor survived multiple packings, unpackings, andthree aircraft drops (packing, opening, landing, and recovery). In thisexample embodiment, the sensor and network system collected data duringthe drop.

In some embodiments, the current disclosure enables methods to ruggedizea sensor system. In certain embodiments, whereas other sensors may befully enclosed in protective pouches, a pressure sensor may need to bespecifically calibrated based on the enclosure used. In mostembodiments, pressures sensors may be uncovered and exposed to the sameatmospheric pressure that experienced by the parachute fabric.

In some embodiments, methods for attaching/removing sensors to/from theconductive network are presented. In some embodiments, a design may useconductive pouches to hold the sensor, processors and batteries. Incertain embodiments, improved attachment methods for pouches andtechniques to electrically connect sensors may be presented. In anexample embodiment, a pouch may hold network components. In mostembodiments, pouches may be attached to the parachute. In other exampleembodiments, pouches may be made to shield and protect components asnecessary.

In a particular example embodiment, a pouch may be used to enclose andhold a conductive network's microcontroller and pressure sensor system.In this example embodiment, this pouch is located underneath the topskin of an Intruder 360. In this example embodiment, a microcontrolleris located inside of the pouch and a sensor is attached to the outeredge of the pouch and underneath the top skin of the Intruder 360 (sothat it is fully exposed to pressure changes during drops). In thisexample embodiment, this pouch houses the control system for thepressure sensors on the parachute (both top-side and in-cell).

In a particular embodiment, adhesion of an electro-textile conductivenetwork to the “zero-porosity” top skin of the Intruder 360 may beenabled. In this example embodiment, a conductive network may be appliedwith a special process of adhesion; the network is embedded inadditional parachute fabric. In this example embodiment, the applicationof this conductive network between fabric minimizes additional weight.

In a particular embodiment, adhesion of an electro-textile conductivenetwork to the top skin of a MC-4 may be enabled. In this exampleembodiment, a conductive network may be applied with a special processof adhesion; the network is embedded in additional parachute fabric. Inthis example embodiment, the application of this conductive networkbetween fabrics minimizes additional weight.

In some embodiments, network branches may be solder interconnects andpermanent connections. In certain embodiments, sensor connections maydepend on the sensors chosen and if the termination points are throughhole or SMT or breakout board.

In some embodiments, the current disclosure enables a conductive networkand devices attached to the conductive network to survive parachutepacking, opening, drop, landing, and recovery. In certain embodiments, apocket located on the top skin of an Intruder, MC-4 or other parachutemay provide a sealed network.

In some embodiments, a complete network and sensors may be enclosed in aconductive shield which forms a Faraday cage.

In certain embodiments, modular harness wiring kits may be used for aconductive network. In some embodiments, a testing fixture for thewiring harness may be used to ascertain continuity, shielding, andconfirm that there is no crosstalk or shorts present. In furtherembodiments, a test fixture may be used after the wiring harness isinstalled in the parachute to verify that the harness was not damagedduring the assembly phase. In some embodiments, a design of a textfixture may be modular to accommodate different numbers of sensorattachment points, different network shape configurations, and variousinstallation paths within the seam during manufacture or on aparachute's skin post manufacture.

In certain embodiments, I²C networks may be a dominant networkconfiguration since many sensors are I²C compatible and a large numberof I²C sensors may be attached to the network. In some embodiments fiveto six I²C sensors may be a typical network, a number that is wellwithin the capability of I²C networks. In further embodiments, lengthmay be a consideration with any network. In other embodiments, a 30 footI²C network with five sensors attached may be used. In some embodiments,I²C network configurations may have the capability to attach I²Cdevices. In a typical network installation, network integrity, networkinterrogation and sensor operation may be confirmed through connectionsto a computer.

In certain embodiments, a GPS may be connected to a microcontroller viaa serial connection.

In certain embodiments, SPI Networks may be useful for a number ofapplications such as pressure measurement where higher sampling speedsare required. In some embodiments, attachment methods may be used totest physical layout for signal integrity. In some embodiments, similarto an I²C network, the SPI network modular may be modular. In manyembodiments, two to three sensors may be attached to SPI networks andthe network may be designed with individual controllers and powersupplies so that these modules can be attached to any location on/in theparachute. In certain embodiments, this may be a low power network. Insome embodiments, one or more wired sensors may be connected to digitaland analog inputs/outputs on the microcontroller.

In some embodiments, three wire sensors may not necessarily benetworked, but conductors may be channeled or run to anywhere on theparachute that three wire sensors are needed. In some embodiments, threewire sensors may be connected to a microcontroller that is also used forthe I²C network demonstrations. In certain embodiments, this may be alow power network.

In some embodiments, two wire devices may also be attached to installedconductors. In certain embodiments, a flap may have on/off commands andmay have a controller to send commands. In many embodiments, an on/offfunction may be integrated in a network and power to the shape memoryalloy actuator may also be run in a power conductor configuration. Insome embodiments, a 6 ampere conductor system may be used. In someembodiments, the network may be connected to a motor or actuator.

In some embodiments, during manufacturing of new parachutes the feedthrough of conductors across seams may be accomplished using conductivetapes. In certain embodiments, this method may be practical when usedduring new parachute manufacture. In some embodiments, if used duringparachute modification it may be necessary to cut stitches, install thetapes and restitch the parachute.

In certain embodiments, there may be numerous prototype parachutevariants. In certain embodiments, parachutes may be a combination of newand modified parachutes. In some embodiment, prototypes may includeround, square, rectangle, and ram air (MC-4, Intruder, sport) canopies.

In certain embodiments, modular conductive network approach and anadaptation of the modular approach for installing the conductive networkin seams may be used. In many embodiments, attaching sensors andmicrocontrollers may be similar for both methods.

In an embodiment, a modular network may be attached using a fabric stripover a conductive network. In this embodiment, a strip and conductivenetwork may be held to a zero porosity Intruder to skin by an adhesiveor sewing. In some embodiments, a modular network may be attached to anytype of parachute fabric. In certain embodiments, stitching of thefabric strip may be to the top skin. In a particular embodiment,adhesion to an Intruder parachute after three airdrops indicated goodadhesion.

In some embodiments, the conductive network may be fully enclosed infabric of other material. In some embodiments the enclosing fabric ormaterial may be attached to the parachute surface.

In an embodiment, a small sample snapshot of typical data from theconductive network/sensors located on the top skin of the Intruder 360is included below. In this embodiment, data collection demonstrates thatdata may be collected on full-scale parachutes deployed from an aircraftin an airdrop environment. In this embodiment, the actual datadownloaded after parachute recovery is representative of data before,during, and after the parachute drop. In this embodiment, the data wascollected from a temperature/humidity sensor, an IMU, and twoaccelerometers. In this embodiment, the network included the sensors, amicroprocessor, SD card to collect data, and a battery. In someembodiments, sensors may be calibrated and compared to the payloadtracking system.

In some embodiments, a solid state device may be used to capture/savedata. In some embodiments an inductive battery charging system may beincluded.

Sample Snapshot of Data at Two Different Times from Modular Networkafter Aircraft Drop Time: 3 Htu21 Temp: 19.22 Hum: 14.23 X: 358.81 Y:0.00 Z: 1.00 CALIBRATION: Sys = 0 Gyro = 0 Acce1 = 0 Mag = 0 Temperature= 18.99 *C. Pressure = 95933.66 Pa X1: 0.02 Y1: 0.16 Z1: −0.98 m/s{circumflex over ( )}2 X2: 0.00 Y2: 0.35 Z2:  0.93  m/s{circumflexover ( )}2 Time: 11931 Htu21 Temp: 21.80 Hum: 14.32 X: 359.56 Y: −24.56Z: 179.25 CALIBRATION: Sys = 0 Gyro = 3 Acce1 = 3 Mag = 1 Temperature =24.28 *C. Pressure = 79277.34 Pa X1:  0.42 Y1: 0.37 Z1: −0.82 m/s{circumflex over ( )}2 X2: −0.14 Y2: 0.03 Z2:  0.89  m/s{circumflexover ( )}2

In some embodiments, the current disclosure may enable terminating,effective shielding, grounding, continuing wires between panels, fourpanel junctions, demonstrating sufficient flexibility for a conductivenetwork and devices that may not interfere with parachute operationswhile maintaining electronic integrity of the circuitry.

In certain embodiments, the current disclosure may present techniquesthat enable

-   -   1) Testing and manufacturing prototype parachutes which meet the        objectives of the user and the needs of the parachute industry    -   2) Proven sensor and electronic conductive network attachment        methods on a full scale parachute and networks that receive        meaningful data from sensors after air drop recovery    -   3) Document techniques and processes to assemble, install,        attach, test, and analyze an electronic conductive network.        In certain embodiments, the current disclosure may enable        parachute canopy systems (MC-4, Intruder, T-11, other) which        includes electronics in a conductive networks. In some        embodiments the sensor data may be retrieved from a solid state        memory device. In some embodiments the sensor data may be        retrieved from a flash memory device. In some embodiments the        sensor data may be retrieved from radio frequency communication        between the on board parachute electronics and ground station.

In many embodiments, flexible, high performance, and lightweightconductors for parachute networks may be enabled; embedding conductorsinto precision fabrics and parachute seams which may be enabled usefulfor military and commercial cargo parachute markets, paraglider markets,as well as the growing market in e-textiles and smart clothing.

In certain embodiments, the techniques of the current disclosure may beapplied to other than parachute networks. In many embodiments,incorporation of the network in the seams may offer tremendousopportunities and further expansion opportunities including puttingsensors in clothing, uniforms, and protective equipment. In someembodiments, health monitoring systems and performance enhancing systemmay be body worn systems. In certain embodiments, worn systems maybenefit by incorporating a conductive network. In further embodiments,microclimate clothing such as cooling and or heating garments maybenefit from incorporating a conductive network. Further embodiments ofconductive networks may be used in FOF (Friend or Foe) identificationsystems to prevent fratricide, and also in the field of adaptivecamouflage, wherein the e-garment blends in with the surrounding area.

In many embodiments, the current disclosure enables the ability toelectronically read sensor information anywhere on the parachute inconjunction with the ability to send control signals to motors andactuators located on the parachute. In certain embodiments, the abilityto measure parachute characteristics during each stage of deployment maybe tremendous in terms of testing and validating current parachutemodels and refining models with actual data beyond boundary valueestimates.

In further embodiments, the current disclosure may enable collection ofinformation (sensored data collection) on the performance of theparachute or parachutist, night parachute lighting, general navigationaids and improved understanding of parachutes from full scaleexperimental data for the academic and R&D community. In mostembodiments, by providing the ability to measure characteristics(pressures, temperatures, accelerations and rotation) anywhere on aparachute, it may be enable the parachute industry with the dataanalytics and real time performance metrics to improve designs.

In an embodiment, the current disclosure enables modification ofparachutes by adding conductive networks to any location on theparachute fabric, i.e., top skin of the canopy, bottom skin of the topcanopy, and any other surface. In certain embodiments, the conductivenetwork may include sensors, microcontrollers, and power sources. Inmany embodiments, a method and processes to incorporate a conductivenetwork on/in a parachute canopy and fabric and connect electronicdevices to the network may be presented. Conventionally, there has beenno known conductive network comparable to the current disclosure.

In many embodiments, the current disclosure may present techniques tocreate a parachute with a conductive network to which sensors andpossibly actuators may be attached. In most embodiments, the currentdisclosure enables a network, resistance to EMI, capable of reuse, andable to withstand the packing and deployment operations.

In almost all embodiments, the conductive network of the currentdisclosure may survive parachute packs and drops. In these embodiments,the sensors performed and survived the drop process. Further, in manyembodiments, the current disclosure enabled attachment of an autonomoussensor network to a parachute canopy and collect data. In manyembodiments, the current disclosure may allow a conductive network to betailored to specific requirements. In some embodiments, as a network maybe in a parachute seam. In other embodiments, a network may be placedoutside a seam. In further embodiments, using the techniques discussedherein, a network may be placed anywhere on the parachute, above orbelow the top skin and under the canopy.

A particular embodiment of a Parachute Network Design, may have a 30foot long sections of S-Shaped folder conductive tape or fabric to serveas a conduit for two nominally 22 AWG size wire in each lobe of theS-shaped folds. For this embodiment, a conductive pocket is attached(sewn) on each end with the pocket opening perpendicular or parallel tothe length of the section. In this embodiment, five conductive pocketsare attached evenly spaced between the ends of the section. In thisembodiment, slits are inserted in the section so the two wires from eachlobe can enter the pocket without being exposed and without restrictingsliding movement of the wires within the lobes.

Refer now to the example embodiment of FIGS. 1a and 1b , whichillustrates a simplified embodiment of a conductive material inside of aseam of a fabric. FIG. 1a illustrates conductive material 110 inside ofseam 120 formed by parachute fabric sections 100 and 105. FIG. 1brepresents a side view of FIG. 1a . Conductive material 110 is inside ofseam 120 formed by fabric sections 100 and 105. The seam is formed byfolding the parachute fabric sections and may be folded in a specificpatterns for each parachute design. In other embodiments, differenttypes of folds may be used to create a seam.

Refer now to the example embodiment of FIG. 1c , which illustratesplacing a conductive material over a seam. In this example embodiment,conductive fabric 125 is placed on top of seam 120. In this embodimentconductive material 125 may be used to create a Faraday cage protectingconductive material 110 in seam 120.

Refer now to the example embodiments of FIGS. 1d and 1e , whichillustrated a conductive material attached to a fabric to cover a seam.Conductive material 125 has been adhered to material 100 to cover seam120 and conductive material 110. FIG. 1e represents a side view of FIG.1d . In the Example embodiment of FIG. 1e , conductive material 125 isadhered to the top side of seam 120 to material 100. In the Exampleembodiment of FIG. 1e , conductive material 126 is adhered to theunderside of seam 120 to material 105. In other embodiments, aconductive material may not be adhered to an underside of a seam. Inmany embodiments, a conductive material may be adhered by any of theaforementioned techniques including but not limited to gluing andsewing.

Refer now to the example embodiments of FIGS. 1f and 1g , whichillustrate a material being attached to parachute fabric to cover aconductive material. In the example embodiment of FIGS. 1g and 1fmaterial 130 is attached to fabric 100 to cover conductive material 125.FIG. 1g represents FIG. 1f after the material 130 has been attached tomaterial 100.

Refer now to the example embodiment of FIG. 2a , which illustratesconductive elements enclosed in a Faraday cage. In the exampleembodiment of FIG. 2, conductive element 210 is in seam 220 formed bymaterial 200 and 205, seam 220 is covered on either side by conductivematerial 225 and conductive material 226. Conductive material 225 iscovered by material 230 and conductive material 226 is covered bymaterial 231.

Refer now to the example embodiment of FIG. 2b , which illustratesmultiple conductive elements in a seam. In the example embodiment ofFIG. 2b , conductive element 210 and conductive element 215 are in seam220 formed by material 200 and 205.

Refer now to the example embodiments of FIGS. 3a, 3b, 3c, and 3d , whichillustrate conductive elements encased in a conductive material. In theexample embodiment of FIG. 3a , conductive material 310 and 320 areenclosed in conductive material 300. Conductive material 300 is foldedinto an “S” shape to provide conductive separation of conductivematerials 310 and 320. Conductive material 300 also forms a Faraday cagearound conductive materials 310 and 320. FIG. 3b represents a side viewof FIG. 3a . FIGS. 3c and 3d represent different views of the flatteningof the “S” material. In certain embodiments, there may be multipleconductive elements 311, 312, 313, 314 that are within a fold of afabric or conductive fabric, 315. In a particular embodiment, conductor311, 312, 313, 314 may represent two or more conductors. In certainembodiments, once the “S” material is flattened similar to that of FIG.3c or 3 d, the flattened material may be threaded through the seam ofanother material. In many embodiments, a conductive material threadedthrough the seam of a material may create a Faraday cage protecting theconductive elements in the folds of the material. In many embodiments,there may be any number of folds providing separation between differentconductive elements. In certain embodiments, where a conductivematerial, such as creating compartments for a conductive material, nofurther covering may be needed to protect the conductive elements.

Refer now to the example embodiment of FIG. 4a , which illustratesmultiple conductive elements in each fold of an “S.” In this exampleembodiment, conductive elements 410 and 415 are contained in the upperportion of material 400 and conductive materials 420 and 425 arecontained in the lower portion of material 400. In this exampleembodiment, each conductive element such as 410, 415, 420, and 425 maybe insulted. In other embodiments, any number of conductive elements maybe in a fold of a material.

Refer now to the example embodiment of FIG. 4b , which representsmultiple folds of a material. In the example embodiment of FIG. 4b ,three conductive elements, conductive element 411, conductive element421, and conductive element 431, are separated by material 401 indifferent folds. Similar to that of FIGS. 3c and 3d , the material ofFIG. 4b may be flattened. Also similar to that of FIG. 3c , the materialmay be threaded through a seam.

Refer now to the example embodiment of FIG. 4c , which illustrates analternative embodiment of multiple conductive elements in folds of aconductive material. In this example embodiment, conductive elements412, 422, 432, and 442, are folded within conductive fabric 402 to forma conductive barrier between the conductive materials. In manyembodiments, a conductive material may provide shielding between eachconductive element to limit interference between the conductiveelements. In many embodiments, conductive elements enclosed in aconductive material may be shielded to withstand substantialelectrostatic events without further shielding.

Refer now to the example embodiment of FIG. 5a , which illustrates aconductive material covering conductive elements threaded through aseam. In the example embodiment of FIG. 5, “S” shaped conductivematerial 510 with conductive elements 511 and 512 is threaded throughseam 520 formed from material 500 and 505. In this example embodimentconductive material 510 enclosing conductive elements 511 and 512 needsno further shielding.

Refer now to the example embodiment of FIG. 5b , which illustrates aconductive material covering conductive elements threaded through a seamthat has been covered with conductive material. In the exampleembodiment of FIG. 5b , “S” shaped conductive material 540 withconductive elements 541 and 542 is threaded through seam 550 formed frommaterial 530 and 570. In this example embodiment seam 550 is covered bya conductive material 560.

Refer now to the example embodiment of FIG. 6a , which illustrate pouch610 attached to a parachute fabric 615 along the edge of a seam 600.FIG. 6a represents a seam 600 formed by fabric 605 and 615 with pouch610 attached at the seam 600 edge. In some embodiments, a pouch, such aspouch 610 of FIG. 6a , may be non-conductive. In some embodiments, apouch, such as pouch 610 of FIG. 6a , may be conductive. In someembodiments, a pouch, such as pouch 610 of FIG. 6a , may be sewn toparachute fabric 615. In some embodiments, a pouch, such as pouch 610 ofFIG. 6a , may be glued to the parachute fabric 615. In some embodiments,a pouch, such as pouch 610 of FIG. 6a , may be sewn and glued toparachute fabric 615.

The example embodiment of FIG. 6b illustrates conductive networkportions 630 and 640 in seam 622 and terminating in the pouch 620. Insome embodiments, the conductors 630 and 640 enter pouch 620 from bothsides and the conductive elements which they contain are connected to adevice in the pouch 620. Seam 622 is formed by two sections of fabric635 and 645 and pouch 620 is incorporated onto fabric 645.

The example embodiment of FIG. 6c illustrates conductive networkportions 632 and 642 in seam 623 and the conductive elements which theycontain terminate in pouch 612, and conductive network portions 632 and642 are incorporated into fabric 650 seam 623. In some embodiments,conductive elements, such as the conductive elements enclosed byconductive network portion 632 and 642 of FIG. 6c , may be continuousand may enter a pouch, such as pouch 612, by conductor taps which may beconnected to a device in a pouch.

Refer now to the example embodiment of FIG. 7 which illustrates aconductive network comprised of conductive elements 730 and 740 whichterminate in pouch 710 on the top of parachute fabric 700 and pouch 720on the bottom side of parachute fabric 700. In some embodiments theremay be more than two conductive elements. In some embodiments,conductors, such as conductive elements 730 and 740 of FIG. 7, may beenclosed in a Faraday cage. In some embodiments, pouches, such aspouches 710 and 720 of FIG. 7, may be non-conductive material. In otherembodiments, pouches, such as pouches 710 and 720 of FIG. 7, may be orhave conductive material. In certain embodiments, pouches, such aspouches 710 and 720 of FIG. 7, may be sewn to a fabric, such as fabric700 of FIG. 7. In some embodiments, pouches, such as pouches 710 and 720of FIG. 7, may be glued to a fabric, such as fabric 700 of FIG. 7. Insome embodiments, a conductive network, such as conductive networkincluding conductive elements 730 and 740 of FIG. 7, may go through aseam. In certain embodiments, a conductive network, such as conductivenetwork of FIG. 7 which includes conductive elements 730 and 740, maypass through a fabric, such as fabric 700 of FIG. 7, between stitches ofthe fabric seam. In some embodiments, a conductive network, such asconductive network which includes conductive elements 730 and 740 ofFIG. 7, may pass through a fabric weave.

Refer now to the example embodiments of FIGS. 8a and 8b , whichillustrate a parachute with conductive elements running through a seam.In the example embodiments of FIG. 8a , conductive network 810 isrunning through seam 820 on parachute 800. FIG. 8a illustrates aconductive network 810 with two conductive elements 822 and 823 insertedin a seam 820 on parachute canopy fabric 800. In many embodiments,conductive elements 822 and 823 may represent multiple conductiveelements. In certain embodiments, conductive element 822 and 823 mayrepresent multiple conductive elements enclosed in a conductive fabric.FIG. 8b represents a close-up of a particular embodiment of a conductivenetwork 810 with conductive elements represented by conductive elements822 and 823 in seam 820 of parachute fabric 800.

Refer now to the example embodiments of FIGS. 8c and 8d , whichrepresent a conductive network crossing a seam. In FIG. 8c , conductivenetwork with segments 850 and 860 crosses seam 835 on parachute 825.FIG. 8c illustrates a conductive network 830 in a seam 835 on parachutecanopy fabric 825 with conductive network branch networks 850 and 860.FIG. 8d represents two conductive elements, conductive elements 855 and865, of branch networks 850 and 860 crossing seam 835 of parachute 825.FIG. 8d illustrates the conductive network branching from the conductivenetwork 830 in the seam 835 and exiting the seam as conductive networks850 and 860. For clarity, the example embodiment, of FIGS. 8c and 8dinclude the conductive elements in seam 820 of FIGS. 8a and 8 b.

In some embodiments, there may be more than two conductors inserted in aseam. In some embodiments, a conductive network may be enclosed in aFaraday cage. In certain embodiments, a conductive network may compriseunshielded conductors.

Refer now to the example embodiments of FIGS. 9a and 9b which illustratea conductive network translating a seam. FIG. 9 is a simplifiedillustration of parachute fabric 900 and 910 or material with a seam andstitches and conductive fabric 920 and 930 folded into the seam fromboth joining pieces of fabric, protruding from the seam, providingcontinuity across the seam and provides a pad for conductor 905 and 915attachment in accordance with an embodiment of the current disclosure;FIG. 9a illustrates the conductors 905 and 915 attached parallel to theconductive fabric 920 and 930.

In some embodiments, conductors, such as conductors 905 and 915 of FIG.9a , may be attached to a conductive fabric, such as conductive fabric920 and 930 of FIG. 9a , by conductive thread. In some embodiments,conductors, such as conductors 905 and 915 of FIG. 9a , may be attachedto conductive fabric, such as conductive fabric 920 and 930 of FIG. 9a ,by conductive epoxy. In some embodiments, conductors, such as conductors905 and 915 of FIG. 9a , may be attached to a conductive fabric, such asconductive fabric 920 and 930 of FIG. 9a , by solder.

FIG. 9b illustrates the conductors 945 and 955 attached perpendicular tothe conductive fabric 940 and 950. In some embodiments, the conductors945 and 955 are attached to the conductive fabric 940 and 950 byconductive thread. In some embodiments, the conductors 945 and 955 areattached to the conductive fabric 940 and 950 by conductive epoxy. Insome embodiments, conductors, such as conductors 945 and 955 of FIG. 9b, may be attached to a conductive fabric, such as conductive fabric 940and 950 of FIG. 9b , by solder.

Refer now to the example embodiment of FIG. 10, which illustrates aconductive network translating a seam. FIG. 10 is a simplifiedillustration of parachute fabric 1000 or material and parachute fabric1100 or material with a seam and stitches and conductive fabric 1030 and1040 folded into the seam from both joining pieces of fabric 1000 and1100. FIG. 10 illustrates the conductive fabric 1030 and 1040 protrudingfrom the seam and providing continuity across the seam. FIG. 10illustrates conductive material or conductive fabric 1025 and 1055covering a conductive elements, such as show in FIG. 9a or 9 b, attachedto the conductive fabric 1030 and 1040. In some embodiments, conductorsmay be attached to conductive fabrics, such as conductive fabrics 1000and 1100 of FIG. 10, by a conductive thread. In some embodiments,conductors may be attached to a conductive fabric, such as conductivefabrics 1030 and 1040 of FIG. 10, by a conductive epoxy. In someembodiments, conductors may be attached to conductive fabric, such asconductive fabrics 1030 and 1040 of FIG. 10, by solder.

Refer now to the example embodiment of FIG. 11, which illustrates anetwork configuration. FIG. 11 which illustrates a power andinterconnections with network nodes and synchronization with a masterclock, timekeeper. In FIG. 11, there are nodes 1110, 1120, 1130, and1140. As well there is timekeeper 1150. Nodes 1110, 1120, 1130, and 1140and timekeeper 1150 are connected by ground 1170, power 1155. Nodes 1120and 1110 are also connected with sync 1160 to each other and timekeeper1150. Nodes 1130 and 1140 are also connected with sync 1160 to eachother and timekeeper 1150. In some embodiments, nodes may represent oneor more different sensors.

Refer now to the example embodiment of FIG. 12 which illustrates I²Cconductive network with a microprocessor and sensors. In the exampleembodiment of FIG. 12, there is accelerometer 1205, accelerometer 1210,SPI 1220 with SD Card 1215, Pressure sensor 1225, IMU 1340, andinterconnects, Vdd 1235, SDA 1240, SCL 1245, Ground 1250, A 1255, aswell as from timekeeper 1260 (clock), VDDIO 1270, and A0/D0 1275.

In some embodiments devices of a conductive network may be physicallylocated near each other. In some embodiments the devices may bedistributed over the area of the parachute canopy. In some embodimentsthe conductive network and sensors may be located on the top surface ofa canopy. In some embodiments a conductive network and sensors may belocated on the bottom surface of a canopy. In some embodimentsconductive network and sensors may be located on a structural surface ofa canopy.

Refer now to the example embodiment of FIG. 13 which illustrates aconductive network covered by fabric 1320 on parachute 1300. FIG. 13illustrates the parachute lines 1310 connected to a parachutesteering/control system 1330. FIG. 13 illustrates parachute controlsystem strapped by straps 1340 to payload 1350. In some embodiments, aconductive network may be connected to a battery or a processor or amemory device on the control system. In some embodiments, a conductivenetwork may be connected to a battery or a processor or a memory deviceon the payload.

Refer now to the example embodiments of FIGS. 14a and 14b , whichillustrate a parachute and a conductive network. The example embodimentof FIG. 14a represents a parachute fabric 1400. FIG. 14 b illustrates aconductive network. Conductive network has devices 1410, 1420, 1425,1430, 1435, 1440, and 1445. Conductive network has conductive elements1450, 1455, 1460, 1470, 1465, and 1475. In some embodiments, each of theconductive elements may contain more than one conductive element. Inmany embodiments, when each conductive element represents manyconductive elements, the conductive elements may be separated by aconductive fabric, such as those of FIGS. 3a and 3b . In manyembodiments, when each conductive element represents many conductiveelements, the conductive elements may be enclosed in a Faraday cage.

Refer now to the example embodiment of FIG. 14c , which represents aconductive network placed on a parachute. In FIG. 14c , the conductivenetwork of FIG. 14b has been attached to parachute fabric 1400. Refernow to the example embodiment of FIG. 14d , which illustrates a coveringover a conductive network on a parachute. In this example embodiment,conductive materials 1480, 1485, and 1490 are placed over the conductivenetwork on the parachute and attached to parachute 1400. In someembodiments, a conductive network may be shielded and covered bynon-conductive fabric; such an alternative embodiment may appear similarto FIG. 14 D where fabrics 1480, 1485 and 1490 of FIG. 14d are benon-conductive.

Refer now to the example embodiments of FIGS. 15a and 15b , whichillustrate a parachute fabric surface, a parachute seam and a conductivenetwork. The example embodiment of FIG. 15a illustrates parachute fabric1500 with conductive element 1502 inside of seam 1503. The exampleembodiment of FIG. 15b illustrates sensors 1510, 1515, 1520, 1525, 1530,1535, and 1540, that when combined with conductive element 1502 form aconductive network. The example embodiment of 15 c illustrates thesensors of FIG. 15b connected to conductive element 1502, furtherconnected with conductive elements 1555, 1560, 1565 and 1570 to form aconductive network.

The example embodiment of FIG. 15d illustrates the conductive network ofFIG. 15c covered by conductive material 1575, 1580, 1582, 1584, and1586. Conductive material 1575, 1580, 1582, 1584, and 1586 form aFaraday cage for sensors 1510, 1515, 1520, 1525, 1530, 1535, and 1540.In certain embodiments, conductive material, such as conductive material1580, 1582, 1584, 1575, and 1586 of FIG. 15c may form pouches forsensors 1510, 1515, 1520, 1525, 1530, 1535, and 1540. In someembodiments, each of the conductive elements may contain more than oneconductive element. In many embodiments, when each conductive elementsrepresents many conductive elements, the conductive elements may beseparated by a conductive fabric, such as those of FIGS. 3a and 3b . Inmany embodiments, when each conductive elements represents manyconductive elements, the conductive elements may be enclosed in aFaraday cage.

Refer now to the example embodiments of FIGS. 16a, 16b, 16c, and 16d ,which illustrates a conductive network inserted into a seam of aparachute. Refer now to the example embodiment of FIGS. 16a and 16b ,which illustrate a parachute fabric surface, a parachute seam 1603 and aconductive network of FIG. 16b . The example embodiment of FIG. 16arepresents a parachute fabric 1600 and parachute seam 1603. FIG. 16aillustrates parachute 1600 with seam 1603. FIG. 16b illustrates aconductive network. Conductive network has device pouches 1610, 1620,1625, 1630, 1635, 1640, and 1645. FIG. 16b represents conductive network1604, which has sensors inside of pouches 1610, 1620, 1625, 1630, 1635,1640, and 1645. Conductive network 1604 has conductive elements 1650,1655, 1660, 1670, 1665, and 1675. In some embodiments, each of theconductive elements may contain more than one conductive element. Inmany embodiments, when each conductive elements represents manyconductive elements, the conductive elements may be separated by aconductive fabric, such as those of FIGS. 3a and 3b . In manyembodiments, when each conductive elements represents many conductiveelements, the conductive elements may be enclosed in a Faraday cage. Incertain embodiments, conductive fabric may be pre-attached to aparachute or fabric and sensors may be inserted into the pouches andconnected to conductive elements to form a conductive network.

Refer now to the example embodiment of FIG. 16c . In the exampleembodiment of FIG. 16c , conductive network 1604 has been inserted intoseam 1603. Refer now to the example embodiment of FIG. 16d , whichillustrates a conductive material 1625 placed over seam 1603, whichcontains conductive network 1604. In some embodiments, pouches may beinserted into a seam of a parachute to cover sensors in a conductivenetwork inserted into a seam. In other embodiments, conductive elementsmay exit a seam into pouches outside of a seam.

Refer now to the example embodiments of FIGS. 17a and 17b , whichillustrate a parachute fabric interior bottom surface and a conductivenetwork. The example embodiment of FIG. 17a represents a parachutefabric 1700. FIG. 17b illustrates a conductive network. The conductivenetwork has device pouches 1710, 1712, 1714, 1716, 1718, 1720, and 1725.Conductive network has conductive elements 1750, 1755, 1760, 1770, 1765,and 1775. In some embodiments, each of the conductive elements maycontain more than one conductive element. In many embodiments, when eachconductive element represents many conductive elements, the conductiveelements may be separated by a conductive fabric, such as those of FIGS.3a and 3b . In many embodiments, when each conductive element representsmany conductive elements, the conductive elements may be enclosed in aFaraday cage. In certain embodiments, conductive fabric may bepre-attached to a parachute or fabric and sensors may be inserted intothe pouches and connected to conductive elements to form a conductivenetwork.

Refer now to the example embodiments of FIGS. 17a, 17b, 17c, and 17d ,which illustrates a conductive network attached to an interior surfaceof a parachute. FIG. 17a illustrates parachute 1700. FIG. 17b representsconductive network 1704, which has device pouches 1710, 1720, 1725,1730, 1735, 1740, and sensor 1745. Conductive network 1704 containconductive elements 1750, 1760, 1755, 1770, 1775, and 1765. Refer now tothe example embodiment of FIG. 17c . In the example embodiment of FIG.17c , conductive network 1704 has been placed on parachute fabric 1700.Refer now to the example embodiment of FIG. 17d , which illustrates aconductive material placed over conductive network. In some embodimentssensors are placed in the pouches and connected to the conductivenetwork. In certain embodiments, a coil of conductive element may offerrelease against strain. In many embodiments, a coil of conductiveelement or elements may be located in a pouch. In other embodiments, acoil of conductive element may be located in a seam.

What is claimed is:
 1. An apparatus comprising: a parachute having aconductive network and fabrics; the conductive network includingconductive elements wherein at least a portion of the conductiveelements are incorporated with at least a portion of the fabrics;wherein the parachute, conductive network, and set of fabrics arearranged to enable the parachute to be packed, deployed, and recoveredwithout damaging the parachute or conductive network; wherein thefabrics are conductive fabrics; and wherein the fabrics form a Faradaycage to shield at least one of the conductive elements; wherein at leastone of the conductive elements is flexible conductive thread.
 2. Theapparatus of claim 1 wherein at least a portion of at least one of theconductive elements is enclosed within one or more insulators.
 3. Theapparatus of claim 1 wherein the parachute has seams; and wherein the atleast a portion of the conductive network is within one or more seams ofthe parachute.
 4. The apparatus of claim 3 wherein at least one fabricof the fabrics is within one or more of the seams of the parachute. 5.The apparatus of claim 4 wherein one or more of the fabrics are placedover at least some of the seams of the parachute.
 6. The apparatus ofclaim 1 wherein at least one of the fabrics is attached to a surface ofthe parachute; wherein the conductive network is inserted between the atleast one fabric of the fabrics and the surface of the parachute.
 7. Theapparatus of claim 1 wherein at least one fabric of the fabrics isenabled to receive one or more devices and shield at least one of theone or more devices with the Faraday cage.
 8. A method of manufacturecomprising: incorporating conductive elements with a parachute;incorporating fabrics with the parachute; incorporating at least oneconductive element of the conductive elements with at least a fabrics ofthe fabrics; and arranging the conductive network and set of fabricswith respect to the parachute to enable the parachute to be packed,deployed, and recovered without damaging the parachute or conductivenetwork; wherein the fabrics are conductive fabrics; and wherein thefabrics form a Faraday cage to shield at least one of the conductiveelements; wherein at least one of the conductive elements is flexibleconductive thread.
 9. The method of claim 8 wherein at least one of theconductive elements is at least partially enclosed within one of moreinsulators.
 10. The method of claim 8 wherein the parachute has seams;and wherein the method further comprises: inserting at a least a portionof the conductive network inside one or more seams of the seams theparachute.
 11. The method of claim 10 wherein at least one fabric of thefabrics is within one or more seams of the parachute.
 12. The method ofclaim 11 further comprising: placing at least one of the fabrics over atleast one of the seams of the parachute.
 13. The method of claim 8further comprising: attaching at least one fabric of the fabrics to asurface of the parachute; and inserting at least a portion of theconductive network between the at least one fabric of the fabrics andthe surface of the parachute.
 14. The method of claim 8 furthercomprising: incorporating a device to be shielded by the Faraday cagecreated by the fabrics.
 15. A parachute with a conductive networkprepared by a process comprising the steps of: incorporating conductiveelements with a parachute; incorporating fabrics with the parachute;incorporating at least one conductive element of the conductive elementswith a at least one of the fabrics; arranging the conductive network andset of fabrics with respect to the parachute to enable the parachute tobe packed, deployed, and recovered without damaging the parachute orconductive network; wherein the fabrics are conductive fabrics; andwherein the fabrics form a Faraday cage to shield at least one of theconductive elements; wherein at least one of the conductive elements isflexible conductive thread.
 16. The parachute of claim 15 wherein atleast one of the conductive elements at least partially enclosed withinone or more insulators.
 17. The process of claim 15, wherein the processfurther comprises: using at least one fabric of the fabrics to shield adevice with the Faraday cage.
 18. The parachute of claim 15 wherein theparachute has seams.